Hybrid PCB Stack-up
Optimizes Signal Integrity and the PCB Cost
Hello
Everyone,
Today
we're going to talk about hybrid PCB. We mainly refer to high frequency
material mixed with epoxy glass.
Let’s
see the stack-up to get idea about hybrid structure.

Layer
1 to layer 2 is the core of RO4350B high frequency material and layer 3 to
layer 4 is the core of FR-4 epoxy glass. The 2 cores are bonded by a sheet of
adhesive (prepreg).
Types of hybrid PCB
The
hybrid PCB can be a mixture of FR-4 and high frequency material as
abovementioned, another type is a mixture of high frequency material with
different dielectric constant (DK), for example RT/duroid 5880 and RO4350B etc.

Why do we use hybrid PCB?
There're
3 main reasons that convince us to use this type of high frequency multilayer
PCB, i.e. cost, reliability improved and electrical properties enhanced.
The
cost of high frequency material is much higher than FR-4, sometimes, when using
hybrid of FR-4 and high frequency material can solve the cost problem.
It
causes reliability problems when the CTE value of the PCB material used is
relatively high, while some high frequency materials have high CTE
characteristics. When a low CTE FR-4 material is combined with a high CTE
material to make a multilayer board, the composite CTE is acceptable, thus
enhancing reliability.
Most
of the time, some lines of the mixed PCB board require very high electrical
performance, some do not require high, in this case, the parts with low
electrical performance requirements will be used FR4, while the parts with high
electrical performance requirements will use more expensive high frequency
materials. Some using different DK of material to make mixed PCB, it is also to
improve electrical properties, such as in some applications of combiners and
filters, using different values of DK material.

Micro-section of a hybrid PCB
Why choose FR-4?
Mixture
of FR-4 and high frequency materials is becoming more and more common because
FR-4 and the vast majority of high frequency materials have little
compatibility problems.

Lamination
To
get a reliable lamination, we first choose PP sheet of high frequency material
and use the correct pressing cycle. The adhesive layer of the same material is
more favorable for the simpler pressing cycle.
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Our PCB Capability
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PCB Type:
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Hybrid PCB, Mixed PCB
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Mixed type:
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RO4350B + FR4;
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RO4003C + FR4;
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F4B + FR4;
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RT/duroid5880 + FR4;
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RT/duroid5880 + RO4350B
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Solder mask:
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Green, Red, Blue, Black, Yellow
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Layer count:
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4 Layer, 6 Layer, Multilayer
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Copper weight:
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0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
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PCB thickness:
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1.0-5.0mm
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PCB size:
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≤400mm X 500mm
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Surface finish:
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Bare copper, HASL, ENIG, Immersion tin, OSP
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Thank
you for your reading and you’re welcome to contact us for your PCB enquiries.