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Rogers RT/Duroid 6006 High Frequency PCB 10mil 25mil 50mil 75mil Rogers 6006 RF Circuit Board

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Shenzhen Bicheng Electronics Technology Co., Ltd

Contact name
Kevin Liao

Quick Information

  • Brand Name: BICHENG
  • Place of Origin: China
  • Model Number : BIC-0101-V2.0
  • Base Material : Rogers6006
  • Board Thickness : 1.3mm
  • Copper Thickness : 1oz
  • Min. Hole Size : 0.4mm
  • Min. Line Spacing : 20mil
  • Min. Line Width : 6mil
  • Surface Finishing : HASLLF
  • :


Rogers RT/Duroid 6006 High Frequency PCB


Hi Guys,

Today we’re going to talk about Rogers 6006 PCB.


Rogers RT/duroid 6006 microwave laminates are ceramic-PTFE composites which are designed for electronic and microwave circuit applications requiring a high dielectric constant. RT/duroid 6006 laminate is available with a dielectric constant value of 6.15.


PCB Capability

PCB Material:

Ceramic-PTFE composite


RT/duroid 6006

Dielectric constant:

6.15  ±0.15 (process)

6.45 (design)

Layer count:

1 Layer, 2 Layer

Copper weight:

0.5oz (17 µm), 1oz (35µm), 2oz (70µm)

PCB thickness:

10mil (0.254mm), 25mil (0.635mm)

50mil (1.27mm), 75mil (1.90mm)

PCB size:

≤400mm X 500mm

Solder mask:

Green, Black, Blue, Yellow, Red etc.

Surface finish:

Bare copper, HASL, ENIG, Immersion tin, OSP.


RT/duroid 6006 microwave laminates feature ease of fabrication and stability in use. This property results in the possibility of mass production and reducing the cost of goods.   It has tight dielectric constant and thickness control, low moisture absorption, and good thermal mechanical stability.


Features and Benefits

1. High dielectric constant for circuit size reduction

2. Low loss. Ideal for operating at X-bank or below

3. Tight DK and thickness control for repeatable circuit performance


The typical applications are aircraft collision avoidance systems, ground radar warning systems, patch antennas, satellite communications systems etc.



Thank you for your reading.

Appendix: Properties of RT/duroid 6006 laminates.

RT/duroid 6006 Typical Value
Property RT/duroid 6006 Direction Units Condition Test Method
Dielectric Constant,εProcess 6.15±0.15 Z   10 GHz/23 IPC-TM-650 Clamped stripline
Dielectric Constant,εDesign 6.45 Z   8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor,tanδ 0.0027 Z   10 GHz/A IPC-TM-650
Thermal Coefficient of ε -410 Z ppm/ -50 -170 IPC-TM-650
Volume Resistivity 7 x 10 7 A IPC
Surface Resistivity 2 x 10 7   Mohm A IPC
Tensile Properties ASTM D638 (0.1/min. strain rate)
Young's Modulus 627(91)        517(75) X                           Y MPa(kpsi) A
Ultimate Stress 20(2.8)         17(2.5) X                    Y MPa(kpsi) A
Ultimate Strain 12 to 13                   4 to 6 X                    Y % A
Compressive Properties   ASTM D695 (0.05/min. strain rate)
Young's Modulus 1069 (115) Z MPa(kpsi) A
Ultimate Stress 54(7.9) Z MPa(kpsi) A
Ultimate Strain 33 Z %  
Flexural Modulus 2634 (382)       1951 (283) X MPa(kpsi) A ASTM D790
Ultimate Stress 38 (5.5)                 X                    Y                MPa(kpsi) A
Deformation under load 0.33                     2.1 Z                    Z % 24hr/50 /7MPa   24hr/150 /7MPa ASTM D261
Moisture Absorption 0.05   % D48/50 0.050"(1.27mm) thick IPC-TM-650
Thermal Conductivity 0.49   W/m/k 80 ASTM C518
Coefficient of Thermal Expansion
ppm/ 23 /50% RH IPC-TM-650 2.4.41
Td 500   TGA   ASTM D3850
Density 2.7   g/cm 3   ASTM D792
Specific Heat 0.97(0.231)   j/g/k
(BTU/ib/ O F)
Copper Peel 14.3 (2.5)   pli (N/mm) after solder float IPC-TM-650 2.4.8
Flammability V-0       UL 94
Lead-free Process Compatible Yes        


  • Delivery Port : Shenzhen

Packaging & Delivery

  • Packing :100 pieces per box
  • Packaging Size : 36 x 36 x 25  Centimeters
  • Package Weight : 12  Kilograms
  • Delivery Lead Time : 15 days
  • Supply Ability : 60000 pieces per month

Product Image

  • 1Rogers RT/Duroid 6006 High Frequency PCB 10mil 25mil 50mil 75mil Rogers 6006 RF Circuit Board image 1
  • 2 Rogers RT/Duroid 6006 High Frequency PCB 10mil 25mil 50mil 75mil Rogers 6006 RF Circuit Board image 2

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