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HDI 4 Layer PCB Built On FR-4 with Blind Via for Mobile Device

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Shenzhen Bicheng Electronics Technology Co., Ltd
[China]

Address
6-11C SHIDAI JINGYUAN,FUYONG,BAO'AN,SHENZHEN Shenzhen Guangdong
Phone
86-0755-27374946
Contact name
Kevin Liao

Quick Information

  • Brand Name: BICHENG
  • Place of Origin: China
  • Model Number : BIC-0466-V2.0
  • Base Material : FR4
  • Board Thickness : 1.6mm
  • Copper Thickness : 1oz
  • Min. Hole Size : 0.3mm
  • Min. Line Spacing : 4mil
  • Min. Line Width : 4mil
  • Number of Layers : 4-Layer
  • Surface Finishing : ENIG
  • :

Description

HDI 4 Layer PCB Built On FR-4 with Blind Via for Mobile Device

 

1.1 General description

This is a type of multilayer PCB built on FR-4 substrate with Tg 150°C for the application of mobile device with blind via technology. It's 1.6 mm thick with white silkscreen(Taiyo) on green solder mask (Taiyo) and immersion gold on pads. The base material is from ITEQ supplying single up PCB. They're fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 25 boards are packed for shipment.

 

1.2 Features and benefits     

Low Z-CTE and excellent through hole reliability

High solderability, no stressing of circuit boards and less contamination of PCB surface.

Shortened connection between electronic components

16000 square meter workshop

Engineering design prevents problems from occurring in pre production.

On-time service

Free stencil shim sent for new user

 

1.3 Application

HDMI Converter,  UHF Radio, Led Light Panel, GPS Tracking System, 1000 Watt Inverter, Led Lighting Solutions, Convert DC To AC, Converter DC DC, PC and Notebook, Control relays     

 

1.4 Parameter and data sheet

PCB SIZE 119 x 80mm=1PCS
BOARD TYPE Multilayer PCB
Number of Layers 4 layers
Surface Mount Components YES
Through Hole Components YES
LAYER STACKUP copper ------- 18um(0.5oz)+plate TOP layer
Core FR-4 0.61mm
copper ------- 35um(1oz) MidLayer 1
PRepreg 0.254mm
copper ------- 35um(1oz) MidLayer 2
Core FR-4 0.61mm
copper -------  18um(0.5oz)+plate BOT layer
TECHNOLOGY  
Minimum Trace and Space: 4 mil / 4 mil
Minimum / Maximum Holes: 0.3 mm /3.5 mm
Number of Different Holes: 9
Number of Drill Holes: 415
Number of Milled Slots: 0
Number of Internal Cutouts: 0
Impedance Control: no
Number of Gold finger: 0
BOARD MATERIAL  
Glass Epoxy:   FR-4 Tg150 , er<5.4.IT-158,   ITEQ
Final foil external:  1oz
Final foil internal:  1oz
Final height of PCB:  1.6mm ±0.16
PLATING AND COATING  
Surface Finish Immersion Gold
Solder Mask Apply To:  TOP and Bottom, 12micron Minimum
Solder Mask Color:  Green, PSR-2000 GT600D, Taiyo Supplied.
Solder Mask Type: LPSM
CONTOUR/CUTTING Routing, stamp holes.
MARKING  
Side of Component Legend TOP and Bottom.
Colour of Component Legend White, S-380W, Taiyo Supplied.
Manufacturer Name or Logo:  Marked on the board in a conductor and leged FREE AREA
VIA Plated through hole(PTH), minimum size 0.3mm. Blind Via Top to Inner layer 1, Bottom to Inner layer 2
FLAMIBILITY RATING UL 94-V0 Approval MIN.
DIMENSION TOLERANCE  
Outline dimension:    0.0059"
Board plating: 0.0029"
Drill tolerance:   0.002"
TEST 100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.


Price

  • Delivery Port : Shenzhen

Packaging & Delivery

  • Packing :100 pieces per box
  • Packaging Size : 36 x 36 x 25  Centimeters
  • Package Weight : 12  Kilograms
  • Delivery Lead Time : 15 days
  • Supply Ability : 60000 pieces per month

Product Image

  • 1HDI 4 Layer PCB Built On FR-4 with Blind Via for Mobile Device image 1
  • 2 HDI 4 Layer PCB Built On FR-4 with Blind Via for Mobile Device image 2

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