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Flexible Printed Circuit (FPC) Built On 1oz Polyimide for Display Carrier

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Shenzhen Bicheng Electronics Technology Co., Ltd

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Kevin Liao

Quick Information

  • Brand Name: Bicheng
  • Place of Origin: China
  • Model Number : BIC-0315-V3.15
  • Base Material : Polyimide
  • Board Thickness : 05mm
  • Copper Thickness : 1oz
  • Min. Hole Size : No
  • Min. Line Spacing : No
  • Min. Line Width : No
  • Surface Finishing : Immersiongold
  • Solder mask / Legend : Black coverlay / White
  • Test : 100% Electric Test


Components of a Flexible Circuit

A flexible circuit consists of copper foil, dielectric substrate+ coverlay and adhesive.

Copper foil is available in two different types of copper: ED Copper and RA copper.


ED copper is an electro-deposited (ED) copper foil produced in the same way as the copper foil used for rigid printed circuit boards. This also means that the copper is treated, i.e., it has a slightly rough surface on one side, which ensures a better adhesion when the copper foil is bonded to the base material.

RA copper is a rolled and annealed copper foil produced from electrolytically deposited cathode copper, which is melted and cast into ingots. The ingots are first hot-rolled to a certain size and milled on all surfaces. The copper is then cold-rolled and annealed, until the desired thickness is obtained.

Copper foil is available in thickness of 12, 18, 35 and 70 μm.


The most common available for dielectric substrate and coverlay is polyimide films. This material can also be used as coverlay. Polyimide is best suited for flexible circuits because of its characteristics as stated below:

     High temperature resistance allows soldering operations without damaging the flexible circuits

     Very good electrical properties

     Good chemical resistance

Polyimide is available in thicknesses of 12.5, 20, 25 and 50 μm.


Base laminates for rigid printed circuit boards are copper foils laminated together with the base materials, the adhesive coming from the prepreg material during lamination. Contrary to this is the flexible circuit where the lamination of the copper foil to the film material is achieved by means of an adhesive system. It is necessary to distinguish between two main systems of adhesive, namely thermoplastic and thermoset adhesives. The choice is dictated partly by the processing, and partly by the application of the finished flexible circuit.



FPC Case: Flexible Printed Circuit (FPC) Built on 1oz Polyimide for display carrier

(Flexible printed circuits are custom-made products, the picture and parameters shown are just for reference)


General description

This is a type of 2 Layer flexible printed circuit (FPC) built on 1oz polyimide for the application of display carrier.


Basic specifications

Base material: Polyimide 25μm + 0.3mm stiffener of FR-4 and 0.1mm Stainless steel

Layer count: 2 layers

Type: Individual FPC

Format: 92.1mm x 54mm = 1 type = 1 piece

Surface finish: Immersion gold

Copper weight: Outer layer 35μm/ Inner layer 0 μm

Solder mask / Legend: Black coverlay / White

Final PCB height: 0.5 mm

Standard: IPC 6012 Class 2

Packing: 100 pieces are packed for shipment.

Lead time: 10 working days

Shelf life: 6 months


Features and benefits

The end can be whole soldered;

Low cost;

Continuity of processing;

Excellent surface planarity to reduce failure rate during assembly and soldering;

Meeting your PCB needs from prototype to mass production;

Powerful PCB capabilities support your research and development, sales and marketing;

Delivery on time higher than 98% on-time-delivery rate;

More than 15 years of PCB experience;



Keypad FPC, LCD module, Industrial control computer soft board, FFC for industrial control equipment


Specifications of standard coverlay


Halogen-free flame-resistant type polyimide film based Coverly (SF305C)
SpecificationsPolyimide Film           Thickness (µm)Adhesive Thickness      (µm)Applications
SF305C 020555Ultrathin FPC
SF305C 03057.55
SF305C 03097.59
SF305C 051512.515General type
SF305C 052012.520
SF305C 052512.525
SF305C 10252525
SF305C 10302530
SF305C 10352535Power batter
SF305C 10502550
SF305C 20505050


Product Code Description

SF305C 05 15 SF305C: Shengyi Coverlay Designation 05: PI Film Thickness, 05- 12.5µm; 10-25µm 15: Adhesive Thickness, 15-15µm, 25- 25µm; 35- 35µm


Quality Policy

Bicheng has developed series of management procedures and approaches to assure that PCBs are in compliance with the customers' requirements, inclusive of selection of the vendors, work in progress (WIP) inspection, outgoing delivery inspection and customer service etc.


Evaluation and Audit of Suppliers

Suppliers have to be evaluated by Bicheng. In addition, Bicheng will appraise and rank suppliers every year to guarantee the materials supplied are meeting Bichengs requirements. Furthermore, Bicheng continuously develop suppliers and supervise them to improve their quality and environment management basing on the systems of ISO9001 & ISO14001.


Contract Evaluation

Bicheng shall review and verify customer's requirements to make sure that we have the capability to satisfy customers' requirements including specifications, delivery and other demands prior to accepting an order.


Making, audit and control of manufacturing data.

When customers' design data and specifications are provided to our market department, Bicheng has to verify all the requirements. Then, convert the design data into manufacturing data by CAM. Finally, a manufacturing instruction (MI) is generated according to the real manufacturing process and technologies for manufacturing department as the basis for actual fabrication. MI must be reviewed by independent engineers and QA engineers before issue.


Incoming Material Quality Control

All materials have to be inspected before warehousing. We established a series of strict inspection procedure and instruction to control the incoming materials. Furthermore, various precise inspecting instruments and apparatus guarantee the capability to judge the material good or not. We issue material with first in first out principle, and give out alarmfor the material that will reach the shelf life to ensure the materials are used up before expiry.


Control of Production Process

Right manufacturing instruction (MI), comprehensive equipment management and maintenance and process control, strict WIP inspection and monitoring as well as working instruction, all those make the whole fabrication process totally controlled.


Final Control and Inspection

All PCBs have to be gone through the open and short test as well as visual inspection after passed the specified physical tests. We own various advanced test equipment including customized, probe flying test machines to guarantee that each PCB is 100% tested.


Product Delivery Audit

We set up a dedicated FQA department to inspect the PCB products according to the customer's specifications and requirements by sampling. Qualified PCBs are going to be packed.


FQA also has to carry out a 100% audit of the warehouse packing and shipping products, including product number, customer number, product quantity, shipping address and so on prior to shipment.


Customer Service

We sets up a professional customer service team to proactively communicate with customers and timely deal with the customers' feedbacks. We highly focus on customers' needs and to understand customersdemands, timely to adjust the policy of customer service and PCB product requirements.



  • UL : E251497


  • Delivery Port : HongKong

Packaging & Delivery

  • Packing :Vacuum
  • Packaging Size : 7 x 8 x 9  Centimeters
  • Package Weight :
  • Delivery Lead Time : 5
  • Supply Ability : 45000

Product Image

  • 1 Flexible Printed Circuit (FPC) Built On 1oz Polyimide for Display Carrier image 1
  • 2  Flexible Printed Circuit (FPC) Built On 1oz Polyimide for Display Carrier image 2
  • 3  Flexible Printed Circuit (FPC) Built On 1oz Polyimide for Display Carrier image 3
  • 4  Flexible Printed Circuit (FPC) Built On 1oz Polyimide for Display Carrier image 4

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