Shenzhen Bicheng Electronics Technology Co., Ltd Company Logo Shenzhen Bicheng Electronics Technology Co., Ltd
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8 OZ Heavy Copper PCB On Aluminum Base Single Sided Aluminium PCB Board

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Shenzhen Bicheng Electronics Technology Co., Ltd
[China]

Address
6-11C SHIDAI JINGYUAN,FUYONG,BAO'AN,SHENZHEN Shenzhen Guangdong
Phone
86-0755-27374946
Contact name
Kevin Liao

Quick Information

  • Brand Name: BICHENG
  • Place of Origin: China
  • Model Number : BIC-0752-V1.0
  • Base Material : Aluminum
  • Board Thickness : 1.2mm
  • Copper Thickness : 8oz
  • Min. Hole Size : na
  • Min. Line Spacing : 17mil
  • Min. Line Width : 16mil
  • Surface Finishing : OSP
  • :

Description

PCB Specifications


PCB Size 90 X 70mm = 1 PCS
Number of Layers 1
Board Type Single Sided PCB
Board Thickness 1.20 mm +/-0.1
Board Material Aluminum PCB, MCPCB
Board Material Supplier ITEQ
Tg Value of Board Material  150
 
PTH Cu thickness N/A
Inner Iayer Cu thicknes N/A
Surface Cu thickness 280 um (8 oz)
 
Solder Mask Type and Model No. N/A
Solder Mask Supplier N/A
Solder Mask Colour N/A
Number of Solder Masks N/A
Thickness of Solder Mask N/A
 
Type of Silkscreen Ink N/A
Supplier of Silkscreen N/A
Color of Silkscreen N/A
Number of Silkscreen N/A
 
Mininum Trace (mil) 16 mil
Minimum Gap(mil) 14.7 mil
 
Surface Finish OSP
RoHS Required Yes
Warpage  0.14%
 
Thermal Shock Test Pass, 288±5 ,10 seconds, 3 cycles. No delamination, no blistering.
Solderablity Test Pass, 255±5 ,5 seconds Wetting Area Least 95%
Function  100% Pass electrical test
Workmanship Compliance with IPC-A-600H & IPC-6012C Class 2




Metal Core PCB Capability 2020

NO. Parameter Value
1 Type of Metal Core Aluminum, Copper, Iron
2 Model of Metal Core A1100, A5052, A6061, A6063, C1100
3 Surface Finish HASL, Immersion Gold, Immersion Silver, OSP
4 Thickness of Surface plating HASL: Sn>2.54 µ m, ENIG: Au 0.025-0.1µm, Ni 2.5-5µm
5 Layer Count 1-4 Layers
6 Maximum of Board Size 23" x 46" (584mm×1168mm)
7 Mininum of Board Size 0.1969" x 0.1969" (5mm×5mm)
8 Board Thickness 0.0157" x 0.2362" (0.4-6.0mm)
9 Copper Thickness 0.5OZ(17.5 µ m) 1OZ(35µm) 2OZ(70µm) 3OZ(105µm) 4OZ(140µm) to 10oz (350µm)
10 Minimum Track Width 5mil (0.127mm)
11 Minimum Space 5mil (0.127mm)
12 Minimum Hole Size 0.0197" (0.5mm)
13 Maximum Hole Size No limit
14 Minimum Holes Punched PCB thickness <1.0mm: 0.0394" (1.0mm)
PCB thikness 1.2-3.0mm: 0.0591" (1.5mm)
15 PTH Wall Thickness >20 µ m
16 Tolerance of PTH ±0.00295" (0.075mm)  
17 Tolerance of NPTH ±0.00197" (0.05mm)  
18 Deviation of Hole Position  ±0.00394" (0.10mm)  
19 Outline Tolerance Routing: ±0.00394" (0.1mm)
Punching: ±0.00591" (0.15mm) 
20 Angle of V-cut 30°, 45°, 60°
21 V-cut Size 0.1969" x 47.24" (5mm×1200mm)
22 Thickness of V-cut Board 0.0236" x 0.1181" (0.6-3mm)
23 Tolerance of V-cut Angle ± 5 º
24 V-CUT Verticality 0.0059" (0.15mm)
25 Minimum Square Slots Punched PCB thickness < 1.0mm: 0.0315" x 0.0315" (0.8 x 0.8mm)
PCB thickness 1.2-3.0mm: 0.0394" x 0.0394" (1.0 x 1.0mm)
26 Minimum BGA PAD 0.01378" (0.35mm)
27 Minimum Width of Solder Mask Bridge. 8mil (0.2032mm)
28 Minimum Thickness of Solder Mask >13 µ m (0.013mm)
29 Insulation Resistance 1012ΩNormal
30 Peel-off Strength 2.2N/mm
31 Solder float 260 3min
32 E-test Voltage 50-250V
33 Thermal Conductivity 0.8-8W/M.K
34 Warp or Twist ≤0.5%
35 Flammability FV-0
36 Minimum Height of Component indicator 0.0059"(0.15mm)
37 Minimum Open Solder Mask on Pad 0.000394" (0.01mm)




Price

  • Delivery Port : Shenzhen

Packaging & Delivery

  • Packing :50pieces
  • Packaging Size : 36 x 36 x 20  Centimeters
  • Package Weight : 12  Kilograms
  • Delivery Lead Time : 14 working days
  • Supply Ability : 60000 pieces per month

Product Image

  • 8 OZ Heavy Copper PCB On Aluminum Base Single Sided Aluminium PCB Board image

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