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RT/Duroid 5870 31mil 0.787mm High Frequency PCB for Radar Systems

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Bicheng Enterprise Limited
[China]

Address
6-11C SHIDAI JINGYUAN,FUYONG,BAO'AN,SHENZHEN Shenzhen Guangdong
Phone
86-0755-27374946
Contact name
Bonnie Shi

Quick Information

  • Brand Name: Bicheng Enterprise Limited
  • Place of Origin: China
  • Model Number : BIC-0016-V5.6
  • Base Material : RTduroid5870
  • Board Thickness : 0.8mm
  • Copper Thickness : 1oz
  • Min. Hole Size : 0.3mm
  • Min. Line Spacing : 5mil
  • Min. Line Width : 5mil
  • Surface Finishing : ENIG
  • Solder Mask Color : Green
  • Colour of Component : White
  • Test : 100% Electrical Test

Description

Specifications of Printed Circuit Board

PCB SIZE 110 x 72mm=1PCS
BOARD TYPE Double sided PCB
Number of Layers 2 layers
Surface Mount Components YES
Through Hole Components YES
LAYER STACKUP copper ------- 35um(1 oz)+plate TOP layer
RT/duroid 5870 0.787mm
copper ------- 35um(1oz) + plate  BOT Layer
TECHNOLOGY  
Minimum Trace and Space: 4.8 mil / 4.5 mil
Minimum / Maximum Holes: 0.3 mm / 4.6 mm
Number of Different Holes: 5
Number of Drill Holes: 87
Number of Milled Slots: 0
Number of Internal Cutouts: 1
Impedance Control: no
Number of Gold finger: 0
BOARD MATERIAL  
Glass Epoxy:   RT/duroid 5870 0.787mm
Final foil external:  1.5 oz
Final foil internal:  N/A
Final height of PCB:  0.8 mm ±0.1
PLATING AND COATING  
Surface Finish Immersion Gold
Solder Mask Apply To:  N/A
Solder Mask Color:  N/A
Solder Mask Type: N/A
CONTOUR/CUTTING Routing
MARKING  
Side of Component Legend N/A
Colour of Component Legend N/A
Manufacturer Name or Logo:  N/A
VIA Plated through hole(PTH), minimum size 0.3mm. Solder mask uncovered
FLAMIBILITY RATING UL 94-V0 Approval MIN.
DIMENSION TOLERANCE  
Outline dimension:    0.0059"
Board plating: 0.0029"
Drill tolerance:   0.002"
TEST 100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.
https://image.ec21.com/company/b/bc/bcc/bcco/img/CA10888241/ED_bcco_20200124110901147.jpg

Data Sheet of RT/duroid 5870

RT/duroid 5870 Typical Value
Property RT/duroid 5870 Direction Units Condition Test Method
Dielectric Constant,εProcess 2.33
2.33±0.02 spec.
Z N/A C24/23/50
C24/23/50
1 MHz IPC-TM-650 2.5.5.3
10 GHz IPC-TM 2.5.5.5
Dielectric Constant,εDesign 2.33 Z N/A 8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor,tanδ 0.0005
0.0012
Z N/A C24/23/50
C24/23/50
1 MHz IPC-TM-650 2.5.5.3
10 GHz IPC-TM 2.5.5.5
Thermal Coefficient of ε -115 Z ppm/ -50 to 150 IPC-TM-650 2.5.5.5
Volume Resistivity 2 x 10 7 Z Mohm cm C/96/35/90 ASTM D 257
Surface Resistivity 3 x 10 7 Z Mohm C/96/35/90 ASTM D 257
Specific Heat 0.96(0.23) N/A j/g/k
(cal/g/c)
N/A Calculated
Tensile Modulus Test at 23 Test at 100 N/A MPa(kpsi) A ASTM D 638
1300(189) 490(71) X
1280(185) 430(63) Y
Ultimate Stress 50(7.3) 34(4.8) X
42(6.1) 34(4.8) Y
Ultimate Strain 9.8 8.7 X %
9.8 8.6 Y
Compressive Modulus 1210(176) 680(99 X MPa(kpsi) A ASTM D 695
1360(198) 860(125) Y
803(120) 520(76) Z
Ultimate Stress 30(4.4) 23(3.4 X
37(5.3) 25(3.7) Y
54(7.8) 37(5.3) Z
Ultimate Strain 4 4.3 X %
3.3 3.3 Y
8.7 8.5 Z
Moisture Absorption 0.02 N/A % 0.62"(1.6mm) D48/50 ASTM D 570
Thermal Conductivity 0.22 Z W/m/k 80 ASTM C 518
Coefficient of Thermal Expansion 22
28
173
X
Y
Z
ppm/ 0-100 IPC-TM-650 2.4.41
Td 500 N/A TGA N/A ASTM D 3850
Density 2.2 N/A gm/cm 3 N/A ASTM D 792
Copper Peel  27.2(4.8) N/A Pli(N/mm) 1oz(35mm)EDC foil
after solder float
IPC-TM-650 2.4.8
Flammability V-0 N/A N/A N/A UL 94
Lead-free Process Compatible Yes N/A N/A N/A N/A
https://image.ec21.com/company/b/bc/bcc/bcco/img/CA10888241/ED_bcco_20200124110917830.jpg


Certificates

  • UL : E251497

Price

  • Delivery Port : HongKong

Packaging & Delivery

  • Packing :Vacuum
  • Packaging Size : 36 x 36 x 25  Centimeters
  • Package Weight : 10  Kilograms
  • Delivery Lead Time : 12 working days
  • Supply Ability : 45000 pieces per month

Product Image

  • RT/Duroid 5870 31mil 0.787mm High Frequency PCB for Radar Systems image

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