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2 Layer Flexible Printed Circuit Board (FPC) Built On Polyimide for Embedded Operating System

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Shenzhen Bicheng Electronics Technology Co., Ltd
[China]

Address
6-11C SHIDAI JINGYUAN,FUYONG,BAO'AN,SHENZHEN Shenzhen Guangdong
Phone
86-0755-27374946
Contact name
Kevin Liao

Quick Information

  • Brand Name: Bicheng Enterprise Limited
  • Place of Origin: China
  • Model Number : BIC-0305-V3.05
  • Base Material : Polyimide 25μm + 0.3mm stiffener of FR-4
  • Board Thickness : 0.20mm
  • Copper Thickness : 35um
  • Min. Hole Size : N/A
  • Min. Line Spacing : N/A
  • Min. Line Width : N/A
  • Surface Finishing : Immersion gold
  • Solder Mask Color : Yellow
  • Colour of Component : White
  • Test : 100% Electrical Test

Description

Components of a flexible circuit
A flexible circuit consists of copper foil, dielectric substrate+ coverlay and adhesive.
Copper foil is available in two different types of copper: ED Copper and RA copper.

ED copper is an electro-deposited (ED) copper foil produced in the same way as the copper foil used for rigid printed circuit boards. This also means that the copper is “treated”, i.e., it has a slightly rough surface on one side, which ensures a better adhesion when the copper foil is bonded to the base material.
RA copper is a rolled and annealed copper foil produced from electrolytically deposited cathode copper, which is melted and cast into ingots. The ingots are first hot-rolled to a certain size and milled on all surfaces. The copper is then cold-rolled and annealed, until the desired thickness is obtained.
Copper foil is available in thickness of 12, 18, 35 and 70 μm.

The most common available for dielectric substrate and coverlay is polyimide films. This material can also be used as coverlay. Polyimide is best suited for flexible circuits because of its characteristics as stated below:
     High temperature resistance allows soldering operations without damaging the flexible circuits
     Very good electrical properties
     Good chemical resistance
Polyimide is available in thicknesses of 12.5, 20, 25 and 50 μm.

Base laminates for rigid printed circuit boards are copper foils laminated together with the base materials, the adhesive coming from the prepreg material during lamination. Contrary to this is the flexible circuit where the lamination of the copper foil to the film material is achieved by means of an adhesive system. It is necessary to distinguish between two main systems of adhesive, namely thermoplastic and thermoset adhesives. The choice is dictated partly by the processing, and partly by the application of the finished flexible circuit.


FPC Case: 2 Layer flexible Printed Circuit Board (FPC) Built on Polyimide for Embedded Operating System
(Flexible printed circuits are custom-made products, the picture and parameters shown are just for reference)


General description
This is a type of 2 Layer flexible printed circuit (FPC) built on polyimide for the application of Embedded Operating System.

Basic specifications
Base material: Polyimide 25μm + 0.3mm stiffener of FR-4
Layer count: 2 layers
Type: Individual FPC
Format: 130mm x 15mm = 1 type = 1 piece
Surface finish: Immersion gold
Copper weight: Outer layer 35 μm/ Inner layer 0 μm
Solder mask / Legend: Yellow coverlay / white
Final PCB height: 0.20 mm
Standard: IPC 6012 Class 2
Packing: 100 pieces are packed for shipment. 
Lead time: 10 working days
Shelf life: 6 months

Features and benefits    
Excellent flexibility;
Reducing the volume;
Weight reduction;
Engineering design prevents problems from occurring in pre-production;
PCB manufacturing is strictly as per required specifications;
Great customer service;
Diversified shipping method: FedEx, DHL, TNT, EMS;
Prototype PCB capability;
Volume Production capability;

Application
Laser head FPC, Mobile phone battery flex board, medical keypad soft board,     LCD module, Industrial control computer soft board, consumer ETC (Electronic Toll Collection ) soft board

Specifications of Standard 1 Layer FCCL

Single side adhesiveless flexible copper clad laminate (SF201)
Specifications Thickness (µm) Copper Type Applications
Polyimide Film Copper Foil
SF201 0512SE 12.5 12 ED Motor, digital products etc.as univeral connector
SF201 0812SE 20 12 ED
SF201 1012SE 25 12 ED
SD201 0518SE 12.5 18 ED
SF201 0818SE 20 18 ED
SF201 1018SE 25 18 ED
SF201 0535SE 12.5 35 ED automotive electronics etc..
SF201 0835SE 20 35 ED
SF201 1035SE 25 35 ED
SF201 1070SE 25 70 ED
SF201 2070SE 50 70 ED Motor, digital products etc.as univeral connector
SF201 0512SR 12.5 12 RA
SF201 0812SR 20 12 RA
SF201 1012SR 25 12 RA
SF201 0518SR 12.5 18 RA
SF201 0818SR 20 18 RA
SF201 1018SR 25 18 RA
Product Code Description  
  SF201 05 12 S E
  SF201: Shengyi Adhesiveless FCCL Designation
  05: PI Film Thickness, 05- 12.5µm; 08-20µm
  12: Copper Foil Thickness, 12-12µm, 18-18µm
  S: Single Sided
  E- ED copper; R- RA Copper







































Quality Policy
Bicheng has developed series of management procedures and approaches to assure that PCBs are in compliance with the customers' requirements, inclusive of selection of the vendors, work in progress (WIP) inspection, outgoing delivery inspection and customer service etc.
  
Evaluation and Audit of Suppliers 
Suppliers have to be evaluated by Bicheng. In addition, Bicheng will appraise and rank suppliers every year to guarantee the materials supplied are meeting Bicheng’s requirements. Furthermore, Bicheng continuously develop suppliers and supervise them to improve their quality and environment management basing on the systems of ISO9001 & ISO14001. 

Contract Evaluation 
Bicheng shall review and verify customer's requirements to make sure that we have the capability to satisfy customers' requirements including specifications, delivery and other demands prior to accepting an order.

Making, audit and control of manufacturing data.
When customers' design data and specifications are provided to our market department, Bicheng has to verify all the requirements. Then, convert the design data into manufacturing data by CAM. Finally, a manufacturing instruction (MI) is generated according to the real manufacturing process and technologies for manufacturing department as the basis for actual fabrication. MI must be reviewed by independent engineers and QA engineers before issue.

Incoming Material Quality Control
All materials have to be inspected before warehousing. We established a series of strict inspection procedure and instruction to control the incoming materials. Furthermore, various precise inspecting instruments and apparatus guarantee the capability to judge the material good or not. We issue material with first in first out principle, and give out “alarm” for the material that will reach the shelf life to ensure the materials are used up before expiry.

Control of Production Process
Right manufacturing instruction (MI), comprehensive equipment management and maintenance and process control, strict WIP inspection and monitoring as well as working instruction, all those make the whole fabrication process totally controlled. 

Final Control and Inspection 
All PCBs have to be gone through the open and short test as well as visual inspection after passed the specified physical tests. We own various advanced test equipment including customized, probe flying test machines to guarantee that each PCB is 100% tested.

Product Delivery Audit
We set up a dedicated FQA department to inspect the PCB products according to the customer's specifications and requirements by sampling. Qualified PCBs are going to be packed. 

FQA also has to carry out a 100% audit of the warehouse packing and shipping products, including product number, customer number, product quantity, shipping address and so on prior to shipment.

Customer Service
We sets up a professional customer service team to proactively communicate with customers and timely deal with the customers' feedbacks. We highly focus on customers' needs and to understand customers’ demands, timely to adjust the policy of customer service and PCB product requirements.
 


Certificates

  • UL : E251497

Price

  • Delivery Port : HongKong

Packaging & Delivery

  • Packing :Vacuum
  • Packaging Size : 8 x 5 x 5  Centimeters
  • Package Weight :
  • Delivery Lead Time : 7-8 working days
  • Supply Ability : 45000 pieces per month

Product Image

  • 12 Layer Flexible Printed Circuit Board (FPC) Built On Polyimide for Embedded Operating System image 1
  • 2 2 Layer Flexible Printed Circuit Board (FPC) Built On Polyimide for Embedded Operating System image 2
  • 3 2 Layer Flexible Printed Circuit Board (FPC) Built On Polyimide for Embedded Operating System image 3
  • 4 2 Layer Flexible Printed Circuit Board (FPC) Built On Polyimide for Embedded Operating System image 4

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