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2 Layer Flexible PCB (FPC) Built On Polyimide for Modem Wireless

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Shenzhen Bicheng Electronics Technology Co., Ltd

Contact name
Kevin Liao

Quick Information

  • Brand Name: Bicheng Enterprise Limited
  • Place of Origin: China
  • Model Number : BIC-0303-V3.03
  • Base Material : Polyimide 12.5μm + 0.2mm polyimide stiffener
  • Board Thickness : 0.15 mm
  • Copper Thickness : 35um
  • Min. Hole Size : N/A
  • Min. Line Spacing : N/A
  • Min. Line Width : N/A
  • Surface Finishing : Immersion gold
  • Solder Mask Color : Yellow
  • Colour of Component : White
  • Test : 100% Electrical Test


Clarifications of FPC
According to the combination of base material and copper foil, flexible circuit board can be divided into two types: flexible board with adhesive and flexible board without adhesive. The price of non-adhesive flexible PCB is much higher than that of adhesive flexible PCB, but its flexibility, bonding force between copper foil and substrate and flatness of solder are also better than that of adhesive flexible PCB. So it is only used in the high demand situations, such as the: COF (CHIP ON FLEX, flexible board with bare chip, the high flatness of the pad) and so on. Because its price is high, most of the flexible PCBs used in the market are still adhesive flexible circuit board. Because the flexible circuit board is mainly used in the situation where bending is required, if the design or process is not reasonable, it is easy to produce micro-cracks, welding and other defects.
Economy of using FPC
If the circuit design is relatively simple, the total volume is small, and the space is suitable, the traditional internal connection is much cheaper. Flexible circuits are a good design option if the circuit is complex, processes many signals or has special electrical or mechanical requirements. When the size and performance of applications exceed the capacity of rigid circuits, flexible assembly is the most economical. A 12mil pad with a 5mil through hole and a flexible circuit with 3mil lines and spacing can be fabricated on a thin film. Therefore, it is more reliable to mount the chip directly on the film. There is no flame retardant that could be an ion source. These films may be protective and solidified at higher temperatures to obtain higher glass transition temperatures. Flexible materials are less costly than rigid materials because they are free of connectors.

FPC Case: 2 Layer Flexible PCB (FPC) Built on Polyimide for Modem Wireless
(Flexible printed circuits are custom-made products, the picture and parameters shown are just for reference)

General description
This is a type of 2 Layer flexible printed circuit (FPC) built on polyimide for the application of Modem Wireless.

Basic specifications
Base material: Polyimide 12.5μm + 0.2mm polyimide stiffener.
Layer count: 2 layers
Type: Individual FPC
Format: 135mm x 82mm = 1 type = 1 piece
Surface finish: Immersion gold
Copper weight: Outer layer 35 μm/ Inner layer 0 μm
Solder mask / Legend: Yellow coverlay / white
Final PCB height: 0.15 mm
Standard: IPC 6012 Class 2
Packing: 100 pieces are packed for shipment. 
Lead time: 10 working days
Shelf life: 6 months

Features and benefits    
Reducing the volume;
Consistency of assembly;
Controllability of electrical parameter design;
SMT process is resistant to reflow soldering, resistant to rework;
16000 square meter workshop;
Competitive price;
On-time service;
More than 15 years of PCB experience;

capacitive touch screen / panel, mobile phone antenna flex board, automobile GPS navigation flex board, contact belt of inkjet printer    industrial control interphone, consumer card reader soft board.

General Properties of Single Sided FCCL

Test Item Treatment Condition Unit Property Date
IPC Standard * value Typical Value
SF201 0512SE SF201 0518SR
Peel Strength (90º) A N/mm ≥0.525 1.0  0.9
288℃, 5s ≥0.525 1.0  0.9
Folding Endurance (MIT) R0.8 X 4.9N Times - >10000 >10000
Thermal Stress 288℃, 20s - - No delamination No delamination
Dimensional Stability MD E-0.5/150 % ±0.2 ±0.1 ±0.1
TD ±0.1 ±0.1
Chemical Resistance After Chemical Exposure % ≥80 >90 >90
Dielectric Constant (1MHz) C-24/23/50 - ≤4.0 3.2 3.2
Dissipation Factor (1MHz) C-24/23/50 - ≤0.01 0.008 0.008
Volume Resistvitiy C-96/35/90 MΩ-cm ≥10^6 4.5 x 10^8 4.5 x 10^8
Surface Resistance C-96/35/90 ≥10^5 3.0 x 10^6 3.0 x 10^6

Explanations: C = Humidity conditioning;
  E = Temperature conditioning;
  * Certified to IPC-4204/11 Copper Clad Adhesiveless Polyimide
Product Code Description  
  SF201 05 12 S E
  SF201: Shengyi Adhesiveless FCCL Designation
  05: PI Film Thickness, 05- 12.5µm; 08-20µm
  12: Copper Foil Thickness, 12-12µm, 18-18µm
  S: Single Sided
  E- ED copper; R- RA Copper

About Us
Bicheng PCB, a unique printed circuit board supplier based in Shenzhen China serves worldwide customers since it’s born in 2003. At Bicheng, every batch of PCB goes through electrical test, AOI inspection, high voltage test, Impedance control test, micro-section, solder-ability test, thermal stress test, reliability test, insulation resistance test and ionic contamination test etc. Finally it is like a beautiful gift to be delivered to your hands.

Different plant scale to suit for your requirements
16000 square meter factory building
30000 square meter month capability
8000 types of PCB per month
ISO9001, ISO14001, TS16949, UL Certified

Variety of PCB technology to meet the market demands
HDI board
Heavy copper board
Hybrid material board
Blind via board
High frequency board
Metal core board
Immersion gold board
Multilayer board
Backplane board
Gold finger board

Comprehensive sales service presale, in sale and after sale.
Quick CADCAM checking and free PCB quotation
Free-of-charge PCB panelization
Prototype PCB capability
Volume Production capability
Quick turn-around samples
Free-of-charge PCB test
Solid carton packing



  • UL : E251497


  • Delivery Port : HongKong

Packaging & Delivery

  • Packing :Vacuum
  • Packaging Size : 8 x 5 x 5  Centimeters
  • Package Weight :
  • Delivery Lead Time : 4-5 working days
  • Supply Ability : 45000 pieces per month

Product Image

  • 12 Layer Flexible PCB (FPC) Built On Polyimide for Modem Wireless image 1
  • 2 2 Layer Flexible PCB (FPC) Built On Polyimide for Modem Wireless image 2
  • 3 2 Layer Flexible PCB (FPC) Built On Polyimide for Modem Wireless image 3
  • 4 2 Layer Flexible PCB (FPC) Built On Polyimide for Modem Wireless image 4

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