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10 Layer Multilayer PCB Built On FR-4 with Immersion Gold for Embedded Programming

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Bicheng Enterprise Limited

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Bonnie Shi

Quick Information

  • Brand Name: BICHENG
  • Place of Origin: China
  • Model Number : BIC-0451-V2.0
  • Base Material : FR4
  • Board Thickness : 2.0mm
  • Copper Thickness : 1oz
  • Min. Hole Size : 0.5
  • Min. Line Spacing : 0.203mm
  • Min. Line Width : 0.203mm
  • Number of Layers : 10-Layer
  • Surface Finishing : ENIG
  • :


10 Layer Multilayer PCB Built On FR-4 with Immersion Gold for Embedded Programming


1.1 General description

This is a type of 10 layer printed circuit board built on FR-4 Tg170 substrate for the application of Embedded Programming. It's 2.0 mm thick with white silkscreen on green solder mask and immersion gold on pads. The base material is from Shengyi and supplying 1 up board. They're fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 20 boards are packed for shipment.


1.2 Features and benefits

Industrial standard material with high Tg (175 by DSC) and  excellent thermal reliability.

Excellent wetting during component soldering and it can avoid copper corrosion.

Engineering design prevents problems from occurring in pre production.

Right manufacturing instruction (MI)

UL recognized and RoHS Directive-compliant

Customer complaint rate: <1%



1.3 Application

Converter, USB Wireless Adapter, 12V Inverter, Wireless Router Reviews, Ladder Logic, Battery Inverter, CCTV Security, Wireless G Router, Programmable Controllers, Backplanes


1.4 Parameter and data sheet

I tem Description Contect
Layer count 10 layer PCB 10 layer board
Board type Multilayer pcb Multilayer pcb board
Board size 168.38 x 273.34mm=1up 168.38 x 273.34mm=1up
Laminate Laminate Type FR4
Supplier SHENGYI
Tg T G 170
Finished thickness 2.0+/-10% MM
P lating Thickness PTH Cu thickness >20 um
Inner layer Cu Thickness 1 /1 OZ
Surface Cu thickness 3 5 um
Solder  Mask Material type L P-4G G-05
Supplier N an Ya
Color G reen
Single / both sides B oth Sides
S /M thickness >=10.0 um
3M tape test NO Peel  Off
Legend Material type S-380W
Supplier T ai yo
Color White
Location Both Sides
3M tape test No peel off
C ircuit T race Width (mm) 0.203+/-20%mm
Spacing (mm) 0.203+/- 20%mm
I dentification U L mark 94V-0
Company Logo QM2
D ate code 1017
Mark location CS
S urface Treatment E NIG Nickel 100u''
Gold 2u''
R eliabilty Tests Thermal shock test 2 88±5 , 10sec ,3 cycles
solder abllity test 2 45±5
Function Electrioal Test 233+/-5
S tandard IPC-A 600H class 2, IPC_6012C CLASS 2 100%
Appearance Visual inspection 100%
warp and twist < = 0.75%
Others V-Cut  thickness 0 .4±0.1 mm
Angle 30+/- 5
Drill table (mm) No  PTH/NPTH Size
1 Y 0.500*1.00+/-0.075 
2 Y 0.508+/-0.075
3 Y 0.610+/-0.075
4 N 0.700+/-0.075
5 Y 0.711+/-0.075
6 Y 0.914+/-0.075
7 N 1.118+/-0.075
8 N 1.219+/-0.075
9 N 1.524+/-0.075
10 N 1.600+/-0.075
11 Y 2.540+/-0.075
12 Y 2.997+/-0.075
13 N 3.500+/-0.075


  • Delivery Port : Shenzhen

Packaging & Delivery

  • Packing :100 pieces per box
  • Packaging Size : 36 x 36 x 25  Centimeters
  • Package Weight : 12  Kilograms
  • Delivery Lead Time : 15 days
  • Supply Ability : 60000 pieces per month

Product Image

  • 110 Layer Multilayer PCB Built On FR-4 with Immersion Gold for Embedded Programming image 1
  • 2 10 Layer Multilayer PCB Built On FR-4 with Immersion Gold for Embedded Programming image 2

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